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Laminated Busbar

The laminated busbar is applied to connect the power devices of the electrical and electronic product. It reduces the distributed inductance of the circuit by means of the structural style of the lamination and parallel distribution of the anode and cathode. In this way, the voltage surge is reduced when the power component is turned off. Therefore, this product lowers the requirement for the voltage resistance of the power component, improves the reliability and stability of the operation of the component and meanwhile enhances the integration level of the current circuit. Last but not least, it is convenient for maintenance.

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Description

The laminated busbar is applied to connect the power devices of the electrical and electronic product. It reduces the distributed inductance of the circuit by means of the structural style of the lamination and parallel distribution of the anode and cathode. In this way, the voltage surge is reduced when the power component is turned off. Therefore, this product lowers the requirement for the voltage resistance of the power component, improves the reliability and stability of the operation of the component and meanwhile enhances the integration level of the current circuit. Last but not least, it is convenient for maintenance.


Product Profile 
The laminated busbar is applied to connect the power devices of the electrical and electronic product. It reduces the distributed inductance of the circuit by means of the structural style of the lamination and parallel distribution of the anode and cathode. In this way, the voltage surge is reduced when the power component is turned off. Therefore, this product lowers the requirement for the voltage resistance of the power component, improves the reliability and stability of the operation of the component and meanwhile enhances the integration level of the current circuit. Last but not least, it is convenient for maintenance.
This laminated Busbar could be customized or specified according to your design or drawings. Clients can also provide information of real application information for us and we can design products on the basis of such information.

Features
1. Low inductance coefficient
2. Compact Structure and effective use of space and control of the system temperature 
3. Minimal impedance and voltage drop
4. Strong overload capacity
5. Reduction of the harms caused by peak voltage to the components and extension of the service life of the electronic components
6. Reduction of the system noise and the electromagnetic interference/radio frequency interference
7. Easy installation and convenient on-site maintenance
8. Fewer components and improvement of the system reliability
9. Equally distributed capacitance
10. Simplicity and beauty in appearance

Product Parameters

ItemDescription
Operating voltage range0~20kV
Rated current range0~3600A
Product structureHot pressing edge sealed, hot pressing edge open, hot pressing edge with potting
Max. size1600×800mm
Flame ratingUL94 V-0
Conductor materialT2 Cu 、 1060 AL
Conductor surface treatmentPassivation, tin plated, nickel plated or silver plated
Connection with the deviceEmbossing, riveted bronze columns, welded copper columns
Insulation resistance20MΩ ~ ∞
Partial discharge<10PC
Temperature rise0 ~ 40K

Testing and Validation Capabilities

Item  Capability of Test Test Equipment Reference Standard Type of Test
Factory ExaminationType TestReliability Testing
AppearanceYesNon/*

Product SizeYes2.5D Optical Instrument/**
Insulation ResistanceYesInsulating Dielectric Strength TesterGB/T 24343-2009 6**
Dielectric StrengthYesInsulating Dielectric Strength TesterGB/T 24344-2009 5.4**
Partial DischargeYesPartial Discharge TesterGB/T 16935.1-2008**
Temperature Rise TestYesProgrammable Frequency Converter/**
Distributed Inductance TestYesInductance Detector/
*
Distributed Capacitance TestYesDigital Electrical Bridge/
*
Fastness TestYesElectronic Universal Testing Machine/
*
Torsion TestYesTorque Wrench/
*
Combustion TestOutsourcing Test
UL 94
*
Low Temperature TestYesConstant Temperature and Moisture Test ChamberGB2423.01 2001

*
High-temperature TestYesConstant Temperature and Moisture Test ChamberGB2423.02 2001

*
Damp Heat TestYesConstant Temperature and Moisture Test ChamberGB2423.3 2006

*
High-low Temperature Cycling TestYesConstant Temperature and Moisture Test ChamberGB2423

*
Salt Spray TestYesSalt Spray Test ChamberGB2423.18-2000

*
Peel Strength TestOutsourcing Test/GB/T 2790-1995

*

Selection of Insulation Materials
The low inductance of the laminated busbar could be ensured by using excellent insulating materials. In order to meet a series of requirements for the electric insulation or environment, customer could make an optimal option on the basis of actual application environment.


Material and PerformanceDensity
(g/cm³ )
Thermal Expansion
Coefficient
Thermal 
Conductivity
W/(kg.K)
Permittivity
(f=60Hz)
Dielectric
Strength
(kV/mm)
Flammability
Rating
Continuous Use
Temperature
Water
Absorption
(%)/24h
NOMEX0.8~1.1
0.1431.6994 V-0220
Polyimide

1.42200.0943.5994 V-02200.24
Polyvinyl Fluoride

1.38530.12610.419.794 V-01050
Polyester Film

1.38~1.41600.1283.325.694 V-01200.1~0.2


Characteristics of the Insulation Material

NOMEXPolyvinyl FluoridePolyester FilmPolyimide
Excellent fire resistance and heat resistance;
good chemical resistance;
Favorable Mechanical Performance; Radiation resistance
Excellent electrical performance and steady chemical property; 
Low hygroscopicity and flame resistance.
Good electrical performance and chemical corrosion resistance;
Low hygroscopicity and economical price.
Favorable heat resistance, 
excellent electrical 
performance; Radiation 
resistance and flame 
resistance.

Simulation Picture of the Laminated Busbar

  • Traditional Copper Bar Current Distribution Ls=73.4nH

  • Bus Bar Current Distribution Ls=10.6nH












Relationship between the Inductance of the Busbar and the Thickness of the Layer Insulation Material of the Busbar

Range of Application

Power ElectronicsIndustrial inverter, inverters, wind power, UPS systems 
high density power distribution cabinets, electric
welding machines, test equipment, large server and medical equipment
TransportationElectric locomotives, Railway trains, electromobile
Electrically driven ships
Aerospace and spaceSatellite systems, Airliner, Space Shuttle, Missile systems
MilitarySubmarines, Communication systems, Armored 
vehicles Radar systems
CommunicationIT servers, super computers
ConnectionAdvantageDisadvantageCost
EmbossingGood performance, high reliabilityTechnological limitationsLow
Riveted bronze columnsEasy to make and it can meet all kinds of design requirementsModerate mechanical performance, it is not suitable for harsh working conditionsModerate
Tin-brazed copper columnsGood mechanical performance, wide application range/High
Silver-brazed copper columnsCompared with tin-brazing, it has lower resistance and higher temperature resistanceHigh costHigher

Treatment Scheme of Busbar Terminal Connection Stress

SolutionAdvantageDisadvantageCost
SlotEasy to make, moderate cushioning effectLower electric performanceLow
Local terminal heat treatmentEasy to make, good cushioning performanceIf contact area is large, contact resistance will be increased and electrical performance will be decreasedModerate
Copper woven belt connectionGood cushioning performance, the assembly deviation has compensatedThe terminal is longer and the stray inductance has increasedHigh
Soft joint with copper foilGood cushioning performance, the assembly unidirectional deviation has compensatedThe terminal is longer and the stray inductance has increasedHighest

Markets & Applications

Dimensions1107x176(mm)
Conductor layers2
Rated voltage1300VDC
Rated current670A
Min. current density2.1A /mm~2
Application fieldsWind Power
Packaging formsHot pressing edge-sealed
Product featuresLocal high current of terminals and low cost for embossing
Dimensions450x418(mm)
Conductor layers2
Rated voltage1000VDC
Rated current600A
Min. current density2.6A /mm~2
Application fieldsPhotovoltaic power generation
Packaging formsHot pressing edge-sealed
Product featuresDifferent installation surfaces for components; high space utilization rate; one-time lamination of Z-shape
Dimensions2400x240(mm)
Conductor layers2
Rated voltage1200VDC
Rated current2500A
Min. current density1.67A /mm~2
Application fieldsShip
Packaging formsHot pressing edge with potting
Product featuresSuper long and super thick; the soft connection is designed to eliminate vibration stress; triple mechanical reinforcement through hot pressing, edge sealed and screws
Dimensions620x510(mm)